AI-ready notebooks are forcing designers to rethink thermal architecture, acoustics, and internal layout all at once.
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...
Struggling with overheating PCBs, airflow bottlenecks, or long thermal simulation runtimes? As power densities rise and form ...
According to onsemi, SiC MOSFETs can run increasingly power-hungry cooling fans in AI data centers more efficiently and reliably than IGBTs. onsemi rolled out its first generation of SiC-based ...
Ventiva Introduces Zoned Cooling™: A Breakthrough Design for Laptops, Edge Devices, and Data Centers
LAS VEGAS--(BUSINESS WIRE)--Ventiva®, a leader in thermal solutions, today at CES 2026 unveiled its Zoned Cooling™ reference design, a new architectural approach to thermal management that transforms ...
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Three-layer microfluidic cooling device can remove heat from small electronics more efficiently
As electronic devices become increasingly powerful and compact, they can generate denser heat fluxes, or in other words, produce more heat in a smaller area. These heat fluxes raise the temperature of ...
Delta Electronics' record March revenue signals a global shift as cloud providers ramp up AI infrastructure spending, ...
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